Silitronics takes pride in delivering Vertically Integrated Design and Assembly Services for next-generation products in AI/ML, Silicon Photonics, High Performance Computing, IoT Sensors, Medical, Defense, LiDAR, RF, and Commercial Applications. Our team brings over 100 years of combined domain expertise in Complex Assembly, Substrate and Board Design, Silicon Assembly, and automated Photonics Active Alignment. Silitronics specializes in advanced Semiconductor IC and Photonics PIC assembly, complemented by value-added design engineering services.
We are seeking a driven IC Assembly Engineer to support the development of fully automated die attach and flip chip assembly processes. This role involves contributing to complex tooling, precision fixtures, and advanced assembly solutions, including photonics applications. It is an excellent opportunity for an engineer passionate about hands-on engineering, learning advanced photonics assembly techniques, and pioneering silicon photonics active alignment solutions for AI, ML, High Performance Computing, and Data Center applications.
You will receive comprehensive training on both automatic and semi-automatic assembly equipment, making this a strong opportunity to expand your expertise in high-precision optoelectronic and silicon photonics assembly.
Responsibilities:
ü Full ownership of Die Attach, Flip Chip, and component attach processes, including creation of Assembly Travelers, Yield tracking, and On-Time Delivery (OTD) performance
ü Collaborate with the technical team to develop assembly process solutions for new RFQs
ü Train operators and technicians on new NPIs while ensuring adherence to Quality Requirements
ü Drive optimization and continuous improvement of existing processes and assembly material BOMs
ü Design and execute DOEs for NPIs to meet quality and customer specifications
ü Analyze assembly yield issues and implement corrective solutions on the production line
ü Provide input for Assembly Traveler processes and execute implementation on the line
ü Prepare weekly reports, including OTD metrics, per customer requirements
ü Manage multiple projects simultaneously
ü Work closely with Sales, Operations, and Quality teams to align on schedules
ü Assess and recommend process modifications to improve yield, enhance efficiency, and reduce cost
ü Collaborate with Silitronics team members to share and implement best practices
ü Mentor team members to strengthen engineering depth and expand organizational capabilities
ü Contribute to patent applications and support IP development efforts
Training Provided:
ü Automatic Die Attach and Flip Chip assembly equipment; future exposure to automated fiber alignment systems (multi-axis, machine vision, feedback-driven alignment)
ü Collaboration with optical, process, manufacturing, and equipment engineering teams to support New Product Introduction
Qualifications:
ü BS in Engineering or equivalent experience
ü US Citizen or GC Permanent Resident
ü 2+ years of hands-on experience in flip chip processes, SAC 305, In Bumps, Micro Bumps, Cu Pillar, soldering, design, and Quality
ü Strong understanding of automated Pick and Place systems with ±0.5µm accuracy
ü Knowledge of SPC, DOE, Physics, Optics, and lens systems
ü Software proficiency: SolidWorks, Tolerance Analysis, Python, MATLAB, C/C++, LabVIEW
Preferred (Nice to Have)
ü Experience with photonics tooling or optomechanical fixture design
ü Background in micro-assembly processes (bonding, laser welding, epoxy dispensing, vision alignment, etc.)
ü Familiarity with FEA tools such as SolidWorks Simulation
ü Ability to thrive in a fast-paced environment with evolving customer specifications while multitasking effectively
ü Strong proficiency in MS Office, presentations, in-depth RFQ analysis and proposals, Gerber viewing for PCBA and stencil design, and project management
Soft Skills
ü Inquisitive mindset with a strong passion for learning
ü Effective communication skills and ability to collaborate across multidisciplinary engineering teams
ü Highly organized, responsive, and capable of working in a fast-paced R&D environment
Why Join Us:
ü Silitronics provides comprehensive health benefits including medical, vision, and dental coverage; company-paid holidays and sick leave; 401(k) with company match; paid vacation; short-term and long-term disability insurance; and company-sponsored events
ü Hands-on training with state-of-the-art fiber alignment technologies (automatic and manual)
ü Opportunity to work on cutting-edge photonics, LiDAR, telecom, and advanced optical assembly solutions
ü Career growth in precision engineering, photonics manufacturing, and optomechanical system development
ü Innovative, collaborative engineering culture
Job Types: Full-time, Permanent
Pay: $120,000.00 - $150,000.00 per year
Benefits:
- 401(k)
- 401(k) matching
- Dental insurance
- Employee assistance program
- Flexible spending account
- Health insurance
- Health savings account
- Life insurance
- Paid time off
- Referral program
- Retirement plan
- Vision insurance
Work Location: In person
