We are seeking two talented and motivated wafer fab process engineers with a focus on advanced semiconductor packaging to join our cutting-edge fabrication team. In this role, you’ll work on the forefront of 3D chip stacking and flip-chip hybridization, building integrated devices that form the heart of next-generation electronic systems. This is your opportunity to work hands-on with state-of-the-art hybridization equipment, contributing directly to breakthrough innovations in device performance and packaging efficiency.
Location: Shoreview, MN
Wage: $70,000 - $85,000/year, depending on experience
Hours: 1st shift | Monday – Friday | 7:30 am – 3:30 pm
Benefits of the semiconductor advanced packaging engineer:
- Be part of a dynamic and innovative engineering team
- Opportunity to grow into a technical leadership role
- Work directly on advanced optical semiconductor technologies
- Career development in a forward-thinking environment
- Health, dental, vision, life, and disability insurance
- 401(k)
- Scheduled raise/salary review
- Company parties
- Stable shop with long term customers
Duties of the semiconductor advanced packaging engineer:
- Operate chip stacking and hybridization equipment (FC-150, FC-300) for flip-chip 3D processes
- Run and support fab tools like evaporation, sputtering, or RIE as needed
- Perform process QC to maintain high yield and product quality
- Document, troubleshoot, and improve processes
- Work with engineering teams to scale operations and build future team capability
Requirements of the semiconductor advanced packaging engineer:
- Bachelor’s or Master’s in Physics or Engineering (required)
- Interest in advanced packaging and hybridization
- Experience with deposition or etch equipment (preferred)
- Flip-chip or 3D packaging experience a plus
Additional information:
Apply today! To learn more about this semiconductor advanced packaging engineer position, contact Matt at 763-571-7077.
EOE: Twin City Staffing is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or veteran status.
Job Types: Full-time, Temp-to-hire
Pay: $70,000.00 - $85,000.00 per year
Benefits:
- 401(k)
- Dental insurance
- Health insurance
- Life insurance
- Vision insurance
Application Question(s):
- Flip-chip or 3D packaging experience
Education:
Experience:
- deposition: 1 year (Preferred)
- etch equipment: 1 year (Preferred)
Work Location: In person
